Xiamen Honglu Tungsten and Molybdenum Industry Co., Ltd. plans to participate in SEMICON China 2019 held in Shanghai New International Expo Center from March 20 to 22, 2018. At the exhibition, we will show our achievements in semiconductor, high-temperature furnace thermal field and other fields in recent years, expand the broader market of tungsten and molybdenum wire and products, and seek more partners. Welcome new and old friends to the site for exchange and guidance.

Exhibition address: Shanghai New International Expo Center, 2/F, Building 1, No. 1158, Zhangdong Road, Zhangjiang High tech Park, Pudong New Area, Shanghai

Our booth: booth No. 1167 in N1 Hall, waiting for your presence.